We have another collection our favorite indie apps that take advantage of Apple’s latest OS features. Today, we’re highlighting: Haven, Structured, Capture, Scrappy, and Fin.

It happens every time: Just before major OS releases, the tech web is flooded with how-to and tips articles. The MacVoices Live! panel looks at why and how you can benefit, including how that flood can offer guidance when new operating systems arrive. The discussion then turns to the Mac App Store allowing developers to […]

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Apple memory supplier SK Hynix is in exploratory talks with Intel about manufacturing memory chips in the United States for the first time, according to Reuters.


One option would see the South Korean chipmaker lease part of Intel's planned manufacturing complex in Ohio. Another would involve a joint venture with Intel and major cloud providers seeking to secure memory supplies, people familiar with the discussions said. No decisions have been made, and other arrangements remain possible.

SK Hynix supplies Apple with memory alongside Samsung and Micron. The discussions come as AI infrastructure spending puts pressure on the supply of memory for consumer devices, including iPhones and Macs. Chipmakers have been directing more production capacity toward high-bandwidth memory (HBM) for AI processors, leaving smartphone and computer manufacturers competing for available supplies.

In February, Apple reportedly agreed to pay Samsung twice as much for memory chips needed for iPhone 17 production. More recently, analyst Ming-Chi Kuo said Apple was reducing its 2026 hardware shipment plans because of DRAM shortages, with supply constraints also affecting the Mac Studio, Mac mini, and MacBook Air.

It remains unclear which types of memory SK Hynix would manufacture under a potential agreement with Intel. Its products include DRAM used in smartphones, computers, and servers, NAND flash storage, and HBM for AI processors. The report does not mention whether a U.S. facility would produce memory for Apple devices.

SK Hynix already has an advanced packaging facility under construction in West Lafayette, Indiana. That project will package DRAM wafers manufactured in South Korea into HBM chips, rather than fabricate the wafers domestically.
This article, "Apple Memory Supplier Explores U.S. Manufacturing With Intel" first appeared on MacRumors.com

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SK Hynix confirmed it is exploring various options to strengthen its global competitiveness, while pushing back on a press report about a potential tie-up with Intel in the US.

The South Korean chip giant issued a statement in response to a Reuters article claiming it had held discussions with Intel about a deal to make memory chips in the US for the first time.

SK Hynix pointed to two other possible scenarios mentioned in the article speculating it could lease part of a long-planned Intel semiconductor manufacturing facility in the US state of Ohio; and referring to the possible formation of a joint venture involving the chip players and major cloud companies.

“No decisions have been made regarding the two scenarios mentioned in this article.”

While SK Hynix indicated it is mulling how to boost its global presence, it added no specific plans or arrangements have been made.

“We would like to clarify that nothing has been finalised regarding cooperation with any specific companies mentioned in the article or memory chip production in the US.”

SK Hynix listed its shares in the US earlier this year, raising more than $26 billion in an IPO as investors seek to tap the AI boom.

US Secretary of Commerce Howard Lutnick said in July SK Hynix should up efforts to expand memory production in the country to address a shortage.

The post SK Hynix denies speculation on chip deal with Intel  appeared first on Mobile World Live.

SK Hynix told TechCrunch the company hasn't finalized any plans or arrangements yet.

Apple today added the 2019 4K iMac to its list of vintage products, which means repairs can only be done if Apple has the parts available.


Products are added to the vintage list five years after they were last distributed for sale, and they're moved to the obsolete list at the seven-year mark. Vintage products can be repaired at Apple Stores and by Apple Authorized Service Providers if the parts are available, but that's not guaranteed. Devices that are obsolete are not eligible for repair and Apple no longer makes repair components.

The 2019 iMac preceded the colorful, redesigned M1 ‌iMac‌ that came out in 2021. The machine featured a 21.5-inch Retina 4K display and the standard silver ‌iMac‌ design. The base model was equipped with an Intel Core i3 processor, 8GB RAM, and a 1TB hard drive. Pricing in 2019 started at $1,299.

The 2019 27-inch ‌iMac‌ that was sold alongside the 21.5-inch model was added to the vintage list in July 2025, but Apple sold the smaller model for a longer so it didn't previously qualify as vintage.
This article, "Apple's Last Intel 21.5-Inch iMac is Now Vintage" first appeared on MacRumors.com

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Intel-backed Altera confidentially filed for a listing in the US, adding to a frenzy of IPO-related activity in the technology sector in 2026.

In a short statement, the company disclosed it had submitted the registration with the Securities and Exchange Commission (SEC).

The number of shares and the price range for the listing was not revealed. Reuters reported last week the firm was preparing the move, with plans to raise more than $2 billion.

Altera makes programmable chips used in data centres, telecoms networks, AI applications and for aerospace and defence systems.

Intel offloaded a 51% majority stake in the business to private equity company Silver Lake last year, a deal that gave Altera a valuation of around $8.8 billion.

As part of the sale, Intel remained on board as a strategic partner and retained the remaining 49%. It acquired the company in 2015 for $17 billion.

Bloomberg reported US IPO activity has soared on the back of large AI investment.

SpaceX set the pace with a record-breaking IPO that raised $75 billion, while SK Hynix raised $29 billion in what was the largest-ever US listing by a foreign company.

There is also more tipped to come, with AI rivals OpenAI and Anthropic in line for market debuts in the next year.

The post Intel-backed Altera files for IPO appeared first on Mobile World Live.

Em meio ao evento “Surprise and shine”, a Apple confirmou que o iOS 27, iPadOS 27, macOS Golden Gate 27, watchOS 27, visionOS 27 e tvOS 27 serão lançados na segunda-feira da semana que vem, no dia 14 de setembro.

Em beta desde junho, os sistemas 27 reúnem uma série de novos recursos para a Apple Intelligence, além da nova Siri AI — vale lembrar, essas funcionalidades podem não ser compatíveis com todos os dispositivos em que os sistemas 27 estão disponíveis.

Em matéria de iPhone, um diferencial relevante para as gerações mais antigas é a implementação de um novo scheduler de CPU ¹Central processing unit, ou unidade central de processamento. para gerenciar melhor as demandas de cargas de trabalho em iPhones a partir do 11, algo já visto anteriormente nos modelos mais recentes — além, claro, de melhorias mais amplas, como na velocidade de envio de arquivos no AirDrop.

No caso do macOS, o maior destaque — além da otimização de desempenho — é o fim do suporte aos Macs com processadores Intel.

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NOTA DE TRANSPARÊNCIA: O MacMagazine recebe uma pequena comissão sobre vendas concluídas por meio de links deste post, mas você, como consumidor, não paga nada mais pelos produtos/serviços usando os nossos links de afiliado.

Notas de rodapé

• 1
  Central processing unit, ou unidade central de processamento.

Leading chipmakers Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced plans to adopt ASML’s latest chipmaking machines in the next several years—and they also joined Intel in agreeing to a crucial technology change that could boost chip production on the new machines by 40 percent.

This signifies the semiconductor industry’s broader embrace of high NA EUV photolithography technology that can cost up to $400 million per machine and is only provided by the Dutch technology company ASML, Bloomberg reports. The technology would allow chip designers to implement even smaller features in potentially more powerful and efficient next-generation chips produced for AI data centers and consumer electronics such as smartphones, tablets, and laptops.

ASML’s EUV (extreme ultraviolet) lithography machines enable chipmakers to use powerful laser light to imprint patterns in silicon wafers, layer by layer, and gradually form the computer circuitry that makes silicon chips work. Compared to older deep ultraviolet lithography, EUV technology harnesses a more powerful source of light with a shorter wavelength to create even smaller features on silicon wafers.

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Leading chipmakers Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced plans to adopt ASML’s latest chipmaking machines in the next several years—and they also joined Intel in agreeing to a crucial technology change that could boost chip production on the new machines by 40 percent.

This signifies the semiconductor industry’s broader embrace of high NA EUV photolithography technology that can cost up to $400 million per machine and is only provided by the Dutch technology company ASML, Bloomberg reports. The technology would allow chip designers to implement even smaller features in potentially more powerful and efficient next-generation chips produced for AI data centers and consumer electronics such as smartphones, tablets, and laptops.

ASML’s EUV (extreme ultraviolet) lithography machines enable chipmakers to use powerful laser light to imprint patterns in silicon wafers, layer by layer, and gradually form the computer circuitry that makes silicon chips work. Compared to older deep ultraviolet lithography, EUV technology harnesses a more powerful source of light with a shorter wavelength to create even smaller features on silicon wafers.

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© Michel de Heer | ASML

A spirited panel debates whether AI companies should surrender part of their ownership to a public wealth fund. The conversation examines distrust of AI, job displacement, data-center energy and water use, income versus wealth taxation, billionaire resentment, corporate political influence, and the dangers of government owning stakes in companies it also regulates.

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SteamOS is continuing its slow march to fuller support on a wider variety of non-Valve hardware. This weekend's release of the SteamOS 3.8.25 Beta includes "initial gamepad support" for a few recent gaming handhelds and improved support for a few others.

Those newly supported handhelds include MSI's Claw 8 EX AI+, the extremely expensive, extremely powerful handheld built around Intel's Arc G3 processor that launched this summer. While SteamOS has long included beta support for "other AMD powered handhelds," Valve has only recently been working on offering compatibility with Intel-based handhelds like the MSI Claw line. This weekend's update suggests the company hasn't abandoned those efforts and that Intel chips aren't being left out of the SteamOS conversation.

SteamOS 3.8.25 also newly supports the controllers built into Ayaneo's Android-focused Pocket S2 and the more recently released Windows-based Konkr Fit. Valve also says the new OS offers "improved support" for older MSI Claw devices and the OneXPlayer line of portable gaming PCs.

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© Aurich Lawson | Steam

Intel proposed a massive $15 billion underwritten public offering of common stock to bolster its balance sheet and aggressively fund its expansion in the high-stakes AI and semiconductor markets.

Financial underwriters include J.P. Morgan Securities, Goldman Sachs, Morgan Stanley and Citigroup Global Markets. Intel stated the companies would have the option for 30-days to purchase up to an additional $2.3 billion in shares, a strategy to secure long-term competitiveness.

“Progress in emerging areas including physical AI, purpose-built silicon, advanced packaging and external wafers represent significant growth opportunities for Intel,” the company stated.

The additional capital targets soaring global demand for technology, as customer investments in AI compute power and physical iterations continue to grow rapidly.

Intel stated net proceeds would cover “general corporate purposes” including working capital and capital expenditures. The company expects the offering to help preserve its investment-grade credit rating during heavy infrastructure investment.

The post Intel launches $15B stock sale to fund AI ambitions appeared first on Mobile World Live.

Intel appointed Marvell executive Dean Jarnac (pictured) as EVP and chief sales officer as the chipmaker seeks to bolster customer engagement and maintain momentum from recent high-profile foundry wins.

The incoming executive will lead Intel’s global sales organisation across its client, data centre, AI, networking and ASIC portfolios.

Jarnac brings over three decades of semiconductor industry experience. In addition to Marvell, he previously held senior leadership roles at Broadcom and AMD.

He will assume the role in September and report directly to CEO Lip-Bu Tan. Jarnac will take over from Greg Ernst, who is departing Intel after 27 years with the company.

Announcing the appointment, Tan highlighted customer focus and operational execution are central to Intel’s growth strategy. He cited Jarnac’s track record of building high-performance sales teams as critical to deepening client partnerships.

The change follows significant progress in Intel’s foundry turnaround strategy. Earlier this year, Google placed an order with Intel to manufacture more than 3 million custom tensor processing units (TPUs) in 2028.

In April, Intel revealed a plan to join Elon Musk’s Terafab AI chip project to build processors for the billionaire’s orbital data centres and humanoid robots.

Apple and Intel reportedly reached a preliminary agreement in May for the latter to manufacture some of the chips for iPhones, iPads and other devices.

The post Intel names new chief sales officer appeared first on Mobile World Live.

Chipmaker Intel joined the OCUDU Ecosystem Foundation as a premier member, bolstering open-source RAN software development for 5G and future 6G networks.

Hosted by the Linux Foundation, the OCUDU Ecosystem Foundation operates as a vendor-neutral collaboration hub.

Its core mission is to establish reference architectures, validation programmes and continuous integration and testing pipelines designed to reduce integration complexity and streamline production rollouts for operators.

Intel’s entry brings technical weight to the initiative, particularly across cloud-native infrastructure, silicon platforms and telecommunications architecture.

Intel plans to contribute technical capabilities to help shape open, standards-based solutions and advance AI-native reference implementations capable of running on software-defined infrastructure.

Arpit Joshipura, GM of networking, edge, and IoT at the Linux Foundation, stated Intel’s leadership in cloud-native systems and telecommunications will bolster ongoing efforts to build an open, interoperable ecosystem, ultimately allowing operators to deploy AI-native open-source RAN solutions faster and with greater confidence as the market shifts from innovation to production.

The foundation’s technical work focuses heavily on the central processing components of open wireless networks: the central unit (CU) and distributed unit (DU). By providing a shared, software-defined reference platform built on open-source code, the initiative aims to address multi-vendor interoperability bottlenecks and eliminate the risk of proprietary vendor lock-in.

Intel joins a growing coalition of communication service providers, infrastructure vendors, system integrators and research institutions backing the open-source initiative following its launch earlier this year.

The foundation continues to invite operators and technology partners to participate in its technical working groups and contribute directly to open reference code, accelerating the transition toward scalable, production-ready open RAN deployments.

The post OCUDU group signs-up Intel to boost open RAN push appeared first on Mobile World Live.

I've liked the Framework Laptop 13 since the first time I used it, partly because I just think the idea of a repairable and upgradeable laptop is cool and partly because it's not Yet Another Ultraportable Trying To Be A MacBook Air Clone. But the design has always had real shortcomings—the most noticeable and serious being its mediocre battery life.

Enter the Framework Laptop 13 Pro. While all previous Laptop 13 refreshes have tinkered around the edges with the original design (a tweaked lid design here, new hinges or new speakers there), the Laptop 13 Pro is as close as we've gotten to a second-generation revision for the original design.

This means that it breaks backward compatibility for some (but not all) Laptop 13 components, most notably the bottom case, the keyboard and trackpad, and the original 55 WHr and 61 WHr battery designs. But by allowing itself to make larger changes to the design, Framework has made major strides in battery life and general fit and finish.

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Intel forecast stronger-than-expected third-quarter revenue and profit on Thursday, fueled by surging demand for its data-center CPUs amid the agentic AI boom. Shares jumped more than 5% after hours as the company also raised its 2026 capital-spending plans, while lingering hopes of a high-profile manufacturing partnership with Apple continue to intrigue investors.

Reuters:
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Intel expects third-quarter revenue between $15.8 billion and $16.8 billion, compared with analysts’ average estimate of $15.1 billion, according to data compiled by LSEG. Adjusted profit is expected to be 38 cents per share, compared with analyst estimates of 27 cents.

On a conference call with analysts, [CEO Lip-Bu] Tan said second-quarter developments prompted Intel to become “fully committed” to high-volume production of ​chips made with its forthcoming 14A manufacturing technology in 2028. Last year, Intel had warned it might be forced to abandon 14A if it could not find a major customer, which would have effectively ​put the U.S. out of the race to make the world’s fastest chips.

“I’m pleased to see the increasing momentum on customer engagements for Intel 14A, and I’m increasingly confident that the 14A will be a highly competitive process,” Tan said.

For the second quarter ended June 27, Intel said sales rose 25.4% to $16.13 billion and adjusted profit was 42 cents per share, compared with estimates of $14.42 billion and 21 cents per share. Adjusted gross margin came in at ​41.8%, versus estimates of 38.8%…

Intel’s foundry business had $5.77 billion in second-quarter sales, compared with analyst estimates of $5.55 billion.

The unit secured Elon Musk’s Tesla as a customer for its next-generation 14A process for ⁠the “Terafab” AI chip ​project. Expectations of another high-profile win rose in April after President Donald Trump announced that Apple AAPL.O had agreed to make ​processors with Intel. Neither company has confirmed the deal.

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MacDailyNews Take: Reported possibilities for Intel’s 14A node in regard to Apple Silicon (based on preliminary agreements and analyst/rumor commentary, none of which have been officially confirmed by Apple or Intel) include:

• Future iPhone A-series SoCs (e.g., successors around the A21/A22 generation) on 14A, potentially entering production toward the end of 2028.

• Certain M-series chips for Macs and iPads, though some reports lean toward earlier nodes like 18A-P for nearer-term Mac chips (around 2027) and 14A for later or higher-end parts.

The 14A node’s density and efficiency gains would suit Apple’s priorities: packing more transistors for stronger CPU/GPU/Neural Engine performance while keeping power consumption low enough for battery-powered devices. Mobile SoCs (especially iPhone chips) are often mentioned among analysts as a strong fit for new advanced nodes because of their volume and efficiency focus.

Important caveats: No official confirmation exists of which specific Apple Silicon products (if any) would use 14A, the exact mix of chips, or volume. Production is still years out, dependent on Intel successfully ramping the process and meeting Apple’s stringent yield, quality, and capacity requirements. Diversifying away from TSMC is the main strategic motive for Apple reigniting business with Intel.

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The post Intel’s AI chip boom sparks rally; Apple deal rumors add extra buzz appeared first on MacDailyNews.

Intel and Google Cloud broadened their multi-year strategic collaboration with plans to deploy Gemini Enterprise and Google Cloud infrastructure across the chipmaker’s global operations as part of a wider AI-driven transformation.

Under the expanded partnership, Intel will roll out Gemini-powered generative AI tools across engineering, supply chain and corporate functions, aiming to scale workforce capabilities through agentic workflows.

The hyperscaler’s infrastructure will also support Intel’s semiconductor development environment, with custom agentic workflows intended to speed up the chip design lifecycle and improve cross-functional execution.

Intel CIO Cindy Stoddard stated the collaboration gives employees a central hub to build and deploy agents through Gemini Enterprise, alongside elastic cloud infrastructure to scale silicon development, as part of the company’s push to move faster and more efficiently.

Karthik Narain, chief product and business officer at Google Cloud, described the partnership as an effort to pair Intel’s engineering expertise with agentic AI tools to create what he called an autonomous foundation for how the chipmaker designs, operates and scales its business.

The companies stated the deployment moves Intel beyond isolated AI pilot programmes. Through the Gemini Enterprise Agent Platform, Intel’s business units will be able to build and run tailored line-of-business agents aimed at automating core processes and speeding up data-driven decision-making.

Gemini’s reasoning capabilities will also power dedicated coding assistance and engineering automation tools designed to streamline software development pipelines and automate multi-step workflows.

Intel is separately piloting Google Cloud-powered tools for marketing and communications, including agents that can identify relevant subject matter experts, draft executive-ready messaging, and generate supporting content across communications channels.

On the infrastructure side, Intel is extending its on-premises compute capacity into Google Cloud’s C4 and N4 instances to support silicon development simulations and core engineering workloads, letting engineering teams run high-performance computing simulations concurrently to shorten chip development cycles.

The tie-up builds on a partnership which has deepened steadily this year. In April, Google committed to using multiple generations of Intel’s Xeon processors, including the 18A-manufactured Xeon 6, to support AI training and inference in its data centres, alongside a plan to co-develop custom infrastructure processing units.

The post Intel, Google Cloud deepen AI partnership appeared first on Mobile World Live.

The partnership between Apple and Intel on chip manufacturing took shape during White House talks over tariff exemptions.

(via Cult of Mac - Your source for the latest Apple news, rumors, analysis, reviews, how-tos and deals.)

Intel outlined a €5 billion capital investment in its Republic of Ireland campus to expand ‌European output to meet the increased demand for AI and high-performance computing.

The chipmaker stated the expansion at its facility in Leixlip, County Kildare, began earlier in the year and involves upgrading fabrication facilities and installing leading-edge manufacturing equipment to boost production of its Intel Xeon 6 and next-generation Xeon processors built on the advanced Intel 3 process node.

Intel stated the chips are increasingly critical to power AI factories.

As part of the infrastructure overhaul, Intel is expanding its “automated track system to integrate disparate campus modules” into a single, “high-velocity production environment”.

Intel explained the investment programme would create permanent high-tech jobs alongside engaging specialised building and equipment installation tradespeople.

Naga Chandrasekaran, EVP and GM of Intel Foundry, said the investment is a “definitive commitment to maximising capacity” for foundry customers.

Upgrading the site “with state-of-the-art technology and installing cutting-edge tools” would help keep the Republic of Ireland “at the forefront of the world’s most advance manufacturing ecosystems while strengthening” Europe’s position in “the global technology landscape”, he said.

The move aligns with broader European Union tech-sovereignty goals to establish a resilient, domestic supply chain for leading-edge processors.

Intel invested more than €30 billion in the Republic of Ireland since establishing operations in 1989. The Leixlip site currently employs 4,900 people.

The company is trying to revitalise its chip manufacturing business and become a serious player in the booming foundry industry.

In April, it signed up to Elon Musk’s Terafab AI chip project to create processors for orbital data centres and robots.

The post Intel pumps €5B into EU AI fab capacity appeared first on Mobile World Live.