World’s First 2,200-V GaN for Next-Gen High-Voltage Power Systems Electronic Design By: Lee Goldberg 21 October 2026 at 19:35 The 2,200-V PowiGaN technology enables higher power density, greater efficiency, and safer and simpler system architectures for AI data centers, EVs, photovoltaics, and HVDC infrastructure. © ID 478538385 © Cloud Yew | Dreamstime.com
Shielded Power Inductors Target Space-Constrained Portable Electronics Electronic Design By: Lee Goldberg 21 October 2026 at 16:15 Bourns’ new series of compact shielded inductors support high-current power designs in wearable and mobile devices. © Bourns
SiC Ups Efficiency of Utility-Scale Battery Storage to Over 99% Electronic Design By: James Morra 20 October 2026 at 19:03 Battery storage supplier Sungrow is adopting onsemi’s SiC power module technology for a 0.4% boost in inverter-level efficiency. © 475236543 © Biletskiy Evgeniy | Dreamstime.com
1,200-V SiC MOSFETs Push Power Density with Top-Side Cooling Electronic Design By: Lee Goldberg 16 October 2026 at 20:30 Microchip's latest SiC MOSFETs adopt the top-side-cooled QDPAK package to maximize heat removal and minimize parasitics. © 183244256 © Luchschen | Dreamstime.com
Battery-Management IC Ensures Long-Lasting Power for 10-Cell Packs Electronic Design By: Lee Goldberg 14 October 2026 at 17:30 STMicro's battery management IC delivers increased precision and faster balancing across its full temperature range. © 282025326 © Asliyuce | Dreamstime.com
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