Intel on Wednesday announced that it had started installing production tools at its Fab 62 in Arizona, and the fab is on track for mass production by late 2028. The company also reported progress on its Ohio One manufacturing complex and confirmed that it has integrated High-NA EUV lithography into high-volume manufacturing (HVM). Meanwhile, Intel continues to invest in its leading-edge process technology R&D, advanced packaging, and photomask production capabilities in the U.S., which puts the company ahead of the competition.

"There is an important difference between technologies made in America and technologies that are truly American-made," wrote Naga Chandrasekaran, executive vice president and chief technology and operations officer, Intel Foundry. "The difference lies in the research and development process that transforms ideas into manufacturable technologies."

Fab 62 to begin operations in 2028

Intel completed construction of its Fab 62 shell some time ago; now it is time for the company to begin installing production tools, which is what it is doing now. Intel expects the new facility to become operational before the end of 2028, although it has not disclosed when it intends to begin high-volume production or which nodes it will produce.

Intel has not officially assigned Intel 14A to Fab 62, although the facility has been discussed as a potential manufacturing site for the node. Meanwhile, there is an important distinction between Intel's original plans for Fab 62 and its current commitments. When Intel announced Fab 52 and Fab 62 in Arizona, it said the two facilities would manufacture its most advanced process technologies, including Intel 20A (2nm-class) and 18A (1.8nm-class). Intel subsequently designated Fab 52 for Intel 18A manufacturing. Yet, Fab 62 remains unassigned.

Given Intel's manufacturing process roadmap disclosed earlier this year, Fab 62 will be able to make chips on 18A, 18A-P, and 14A nodes. Intel currently manufactures Intel 18A chips at the neighboring Fab 52, whereas Fab 62 could potentially accommodate either additional Intel 18A capacity or the company’s next-generation Intel 14A process technology. However, Intel has yet to confirm its plans for the facility.

The facility will become Intel's Fab 62, the sixth high-volume semiconductor manufacturing fab at its Ocotillo campus, which has served as one of the company’s primary production sites for decades.

Intel has also not revealed Fab 62's planned wafer processing capacity, or the amount of capital expenditures required to complete the facility. Nevertheless, the installation of production equipment indicates that the project has progressed beyond construction of the building itself. The new fab will expand Intel’s manufacturing footprint in Arizona, where the company already produces leading-edge processors and operates advanced packaging, assembly, and testing facilities.

Intel confirms High-NA EUV insertion into mass production

Another noteworthy disclosure concerns Intel's deployment of High-NA EUV lithography. Intel was the first chipmaker to install a commercial High-NA EUV scanner at its D1X fab near Hillsboro, Oregon, and subsequently integrated the tool into high-volume manufacturing to produce its Panther Lake and other chips.

The Gordon Moore Park at Ronler Acres in Oregon is where Intel develops its most advanced logic process technologies and initiates volume production of the latest processors. Usage of High-NA EUV to produce select tiles for Panther Lake CPUs at D1X is a natural fit for the development fab, as it helps Intel to better understand how these lithography systems work. Meanwhile, it seems (though Intel has not explicitly confirmed) that, for now, High-NA EUV scanners are used to produce the same circuits as Low-NA EUV machines, so the use of next-generation lithography systems does not necessarily provide significant advantages over existing litho scanners.

Ohio One reaches another construction milestone

Intel has also made progress with its 'Ohio One' manufacturing complex in New Albany, Ohio. Construction workers recently installed the first major structural truss at the site's first semiconductor fab, which represents a milestone in the development of the company's manufacturing operations in the state. The project is clearly an important part of Intel's long-term strategy to expand domestic production of chips using leading-edge process technologies for years to come.

Unfortunately, Intel did not provide an updated construction schedule for Ohio One or disclose when the first fab is expected to begin operations. Intel also did not reveal which process technology the facility will eventually use or the estimated manufacturing capacity it will provide. Therefore, while construction continues, which is good news, the announcement does not clarify exactly when Ohio One will contribute to Intel's output.

Other investments across the U.S.

In addition to leading-edge manufacturing capacity in the U.S., Intel continues to invest in advanced packaging technologies. Oregon serves as the company's main research and development center for advanced logic and 3D interconnect technologies, while Arizona hosts advanced packaging R&D, assembly, and testing operations. Intel uses its site in New Mexico to produce its complex multi-chiplet processors relying on advanced packaging methods — starting with modest EMIB and all the way to next-generation EMIB-T and Foveros technologies.

Also, Intel recently broke ground on a new photomask manufacturing facility in Santa Clara, California. The new facility will be an important part of Intel's supply chain in the U.S., as the company will be the only chipmaker in America to develop and produce chips using leading-edge nodes completely in the U.S. (both Samsung and TSMC currently lack leading-edge process R&D in America; they do not run their own photomask shops in the U.S., and Samsung has abandoned its plan to build an advanced packaging facility in Texas). Of course, Intel critically depends on tools from Europe and materials from Japan, but even as its major rivals invest hundreds of billions in their U.S. production capacity, Intel remains ahead.

To highlight its American supply chain, Intel disclosed that its U.S. operations involve more than 4,500 suppliers across 49 states, as its annual domestic expenditures exceed $29 billion. The company stressed that domestic semiconductor leadership requires not only wafer fabrication capacity but also research, process development, advanced packaging, and a comprehensive supply chain.

Elon Musk says ASML and other critical semiconductor equipment suppliers have expedited shipments for the ambitious Terafab semiconductor manufacturing facility, supporting his aggressive timeline for the joint megaproject between Tesla and SpaceX. He made the announcement during a live broadcast of SpaceX's Q3 2026 earnings call on X yesterday, October 20. Musk also said the company is targeting volume chip production at the project's primary facility in Gibbons Creek, Texas, by the third or fourth quarter of 2028, emphasizing that the timeline is highly aspirational and carries "big error bars."

"These are very aggressive dates, and we're very appreciative of ASML and all of our other suppliers in accelerating equipment deliveries in order to achieve this outcome," said Musk, CEO of both companies behind Terafab. SpaceX plans to manufacture its first experimental test chip at its research fabrication facility in Austin, Texas, around Q2 2027.

Aside from Terafab, Musk also outlined near-term ambitions for his AI companies during the broadcast, saying he expects them to have 2.5 to 3 gigawatts (GW) of computing capacity active by the end of 2026. He also stated he is highly confident about bringing an incremental 10 GW online in 2027, saying he "would be surprised" if they do not hit a total of 13 GW of AI compute by the end of 2027.

Meanwhile, the next-largest project by planned capacity, the now-restructured 10 GW Project Stargate, was expected to reach full capacity in the 2030s. Meta's 5 GW Hyperion also has a similar timeline. To achieve the 13 GW milestone, Musk revealed that SpaceX and xAI are aggressively procuring upcoming next-generation NVIDIA architecture. He announced plans to get a massive 440,000-GPU Nvidia "Vera Rubin" training cluster online by the end of Q2 2027.

Shifting back to Terafab, Musk also boasted that once fully scaled and operational, the sheer commercial value of Terafab's advanced chip output will place it within the top 20 global country GDPs from a single physical building. For context, the 20th country on the list is Switzerland, with a GDP of around $1.14 trillion. The facility is a planned multi-billion-dollar, vertically integrated chip factory in Texas, with an ambitious goal of manufacturing 1 terawatt (TW) of AI computing power per year. Terafab will fabricate logic, memory, and advanced packaging internal architectures in one place. The project's massive planned output has mandated various collaborations across the semiconductor supply chain. Terafab will utilize traditional extreme ultraviolet (EUV) lithography systems utilizing Intel's 14A manufacturing node technology.

Intel officially joined the Terafab venture in April 2026 to help co-develop and refactor silicon fabrication technology, providing access to its state-of-the-art 14A manufacturing process. ASML, the world's sole commercial supplier of the $400 million EUV lithography systems required for high-volume, leading-edge chip production, is perhaps the project's most critical partner. Terafab's first EUV tool was reportedly slated for delivery in mid-2027, according to unofficial sources. It remains unclear if this is the expedited timeline Musk referred to in the broadcast.

Other major suppliers include American equipment manufacturers Applied Materials, Lam Research, and KLA Corporation, as well as Japan's Tokyo Electron. These companies will provide front-end processing, metrology, and process control machinery. Tesla and SpaceX are also in talks with about 10 South Korean equipment makers, including Hanmi Semiconductor, known for advanced packaging equipment, and HPSP, a high-pressure hydrogen annealing equipment manufacturer, as well as firms providing specialized piping components and process valves.

Musk's announcement says that several of these suppliers are expediting supply to Terafab, even as capacity remains tight across the semiconductor supply chain. The facility, which aims to mitigate future shortfalls of cutting-edge AI processors from external foundries like TSMC, will supply the chips for Musk's xAI clusters, self-driving vehicles, Optimus humanoid robots, and SpaceX's orbital AI data center, as well as the broader AI industry.

However, many experts have questioned the validity of Musk's 1 TW Terafab ambition. For context, research firm Gartner estimates the total global AI-optimized data center capacity is roughly 44 GW as of late 2026, 4.4% of Terafab's planned output. Although global AI computing capacity has grown by roughly 3.3x to 3.4x per year since 2022, according to EpochAI.

Three contract workers died, and one more is in intensive care after an accident at the construction site for TSMC’s 2nm Fab 22 in Kaohsiung, Taiwan, reports Taiwan’s Central News Agency. The Southern Taiwan Science Park (STSP) Bureau suspects the cause was a broken bolt on a steel connection plate that sent the workers and steel components tumbling. Steel hoisting on the project has been halted, and the STSP has sent labor inspectors to investigate. The accident is not the first of its kind but rather follows at least a half dozen others since September 2024 at TSMC construction sites in Taiwan, according to local reports. Each of those earlier accidents killed one worker.

Local police said that the men were welding a steel beam on an upper floor and fell with it, while the STSP said the workers were performing steel-structure hoisting and installation when a third-floor connection-plate bolt apparently broke.

10 emergency vehicles were sent to the site with 22 personnel, and all four men involved in the incident were taken to the hospital. On-site medical staff gave first aid, but three of the workers died despite resuscitation efforts, and the fourth was moved to intensive care. The workers were employed by a contractor working on the fourth phase of the complex’s construction, and TSMC said the area was within that contractor’s scope of work.

According to the report, TSMC stopped the related construction work on its own and is working with authorities and supervising the subcontractor’s follow-up.

The Fab 22 complex, located in Kaohsiung’s Nanzi District, is part of the science park and is being built to accelerate 2nm manufacturing. TSMC entered high-volume 2nm, or N2, manufacturing in the fourth quarter of 2025, including at Fab 22. The complex has five phases planned, with a total investment TSMC puts at more than NT$1.5 trillion, or about $46 billion. The accident happened on the construction side, not in a producing fab. Kaohsiung’s deputy mayor said construction on Phase 4 began in August 2025, with operations expected in the fourth quarter of 2027.

Business Today reports that TSMC fab construction has increased, from four fabs a year in 2017–2024 to nine a year in 2025 and 2026. The deaths come as the company plans for 13 new leading-edge and advanced-packaging fabs in Taiwan, with company-wide capex of $60 billion to $64 billion this year.

The faster pace has encouraged the addition of a contractor’s safety record as a weight in selection and a plan for a Taiwan Semiconductor Construction Engineering Safety Association with construction partners. TSMC Chairman C.C. Wei said at last year’s shareholders meeting that safety cannot be compromised, and the company’s 2025 annual report said it will keep investing in fabs across several locations in Taiwan “with a strong emphasis on construction site safety.”

Cliff Hou, TSMC senior vice president and deputy co-COO, told Business Today that increased worker count and overlapping construction have raised the risk, requiring careful supervision, and that TSMC’s contractor lost-time injury rate had fallen about 42% from last year’s high as of late May, when the publication toured the Nanzi site to see the overhaul. It’s too early to call the program a failure, with the cause as yet unknown.

The accident comes less than a week after an explosion killed two people at Intel’s chip plant in Israel, though that was an operating fab rather than a construction site. Both accidents come as chipmakers race to meet demand, with global chip sales passing $1 trillion through August, according to the Semiconductor Industry Association.

The STSP’s findings will determine what penalties, if any, will fall under Taiwan’s Occupational Safety and Health Act, while it assists the victims’ families. No date has been given at this time for that or for the Phase 4 steel hoisting restart. Nor has TSMC commented on any schedule impact.

Intel has asked the Federal Communications Commission (FCC) to make an exception for the automated guided vehicles (AGVs) that the company uses to transport the sensitive silicon wafers and other materials, containers, and supplies needed to make the most advanced chips in its fabs. According to Bloomberg, the American chipmaker fears that its AGVs would fall under the blanket prohibition against foreign-made robots after they were added to the FCC’s Covered List.

AGVs are niche machines that chip fabs use to transport materials and supplies between tools and sections of the fab, helping ensure that the cleanroom conditions required for each manufacturing process are maintained. This makes them critical equipment for U.S. semiconductor manufacturing, but, apparently, there are no suitable domestic alternatives for these devices at the moment. Intel’s current fleet of AGVs requires continuous maintenance, including software and firmware updates, and if it’s forced to find a local supplier for its AGVs, the company says that it would take years, crippling the United States’ chipmaking efforts.

The biggest AGV suppliers are Japanese companies like Murata Machinery and Daifuku Co., while a few smaller businesses from South Korea and Taiwan are also trying to break into the market. It’s unclear why these companies haven’t applied for a conditional approval yet, which would allow them to continue selling these products in the U.S. while also promising Washington that they’ll set up a manufacturing base in the country. This is something that Netgear has already done, allowing it to continue selling its foreign-made routers despite being an American company.

Intel says that it remains unclear if updates to its AGVs would break compliance with the FCC, and that it’s asking the agency to issue a conditional waiver “out of an abundance of caution to ensure the ongoing operation of these specific AGV units.” While Team Blue is the only company concerned about AGVs at the moment, other chip manufacturers would likely need a similar waiver in the near future, especially as they build more fabs in the U.S. This includes TSMC, which is planning to build 12 more fabs and four packaging facilities in Arizona, Samsung, with its new Taylor, Texas, fab, and even Elon Musk’s Terafab, which has already begun construction.

Washington has been using the FCC to force companies to invest in American manufacturing. Its blanket bans on foreign-made products like drones and routers have affected some of the biggest brands in the U.S., including DJI and TP-Link. While these bans do not outright ban the sale of all products made by these companies, especially those that have already been approved before, they make it impossible for them to introduce new products and even release software updates to their existing product line. The FCC eventually walked back on the software update ban, but they still would not be able to register new products unless they build them in the U.S.